Low-dimensional physics in
semiconductor nano-structures, such as quantum wells, quantum wires and quantum
dots (QDs) have attracted much interest in recent years. Among these
nano-structures, the two-dimensional (2-D) wells and barriers have been grown
since 1970s. The defect-free zero-dimensional QDs have also been achieved since
the early 1990s using the self-assembly growth technique. Many interesting
properties and phenomena of these QDs have been studied. In contrast, the study
on the growth and characterization of quantum antidots (QADs) is seriously
lacking. Recently, many interesting phenomena related to antidots have been
observed. However, in these studies, almost all the antidots were fabricated
using external processing techniques, such as e-beam lithography, atomic force
microscopy related methods and focused ion beam. The defect-free,
self-assembled growth of antidots was rarely studied.
In the
growth of self-assembled InAs/GaAs QDs in Stranski–Krastanow mode, the surface
energy minimization dominates the surface morphology of InAs layer. When the
deposited amount of InAs increases to the so-called transition thickness (about
1.5ML), the 2-D to 3-D transition happens due to the strain-induced increment
of surface energy. The surface energy depends on many factors, such as lattice
mismatch between GaAs and InAs, substrate temperature, growth rate, III/V
ratio, etc. To obtain a quantum-size 3-D island, it is necessary to have a
large enough lattice mismatch between two materials. In InAs/GaAs system, the
lattice mismatch is about +7%. For InAs QDs, the strain in the dots is
compressive. For GaAs/InAs anti-dots, the strain becomes tensile in the dots. The
2-D to 3-D transition for the anti-dot formation naturally also depends on the
amount of lattice mismatch, material elastic constant and other material
parameters. These factors determine the transition thickness under definite
growth conditions. In this work, we studied experimentally the GaAs antidots
growth in InAs matrix on (100) InAs substrate. Under proper growth
conditions, 3-D island formation has been observed clearly by both atomic force
microscope (AFM) and Transmission electron microscope (TEM) methods. The
transition thickness and antidots sizes are discussed in detail.
2.
Experimental result and discussion
The
samples were grown on the (100) InAs substrate by a solid-source
Varian Gen II molecular beam epitaxy (MBE) system equipped with an arsenic
cracker cell. After native oxide desorption at 510°C, a 0.5μm InAs buffer layer was deposited before
the GaAs growth. With about 40nm InAs spacer, 1.5, 1.75, 2, 2.25, and 2.5ML GaAs were
deposited sequentially. After the last GaAs layer was deposited, the sample was
cooled down under arsenic flux. Migration-enhanced epitaxy (MEE) method was
used for each GaAs layer growth. That is, after each 0.25ML GaAs
deposition, we introduced growth interruption for 10s. In this 10s period, the
arsenic shutter was kept open for the first 5s, and then closed for the next 5s.
The growth temperature and the growth rate for GaAs were 500°C and 0.1μm/hr,
respectively. The III/V beam equivalent pressure ratio of In (Ga) was 25(10).
Fig. 1 shows an AFM image of the
grown sample. The measurement was performed in the tapping mode by a DI-5000
AFM system. From the image, a clear 3-D, dot-like morphology is observed. From
the surface profile analysis of the AFM, the shape of the islands is almost
isotropic, with about 15–35nm in base diameter and about 2–4nm in height. The
density of the GaAs antidots was about 3–4×1010cm-2 averaged
over several observed 1×1μm2 images.

Fig. 1. AFM
image of 2.5ML GaAs on InAs.
Fig. 2 and Fig.
3 show the TEM images for the sample. In Fig. 2, there are 5 layers of GaAs with different
thickness as stated above. From the figure, we can see that for less than or
equal to 2.25ML GaAs deposition, there is no 3-D island
formation. For the fourth layer (with 2.25ML GaAs) from
the bottom, strain fields in some isolated spots were observed. In the layer
with 2.5ML GaAs deposition, clear QADs were observed.
The high-resolution TEM image for one of the GaAs antidots formed on the sample
surface is shown in Fig. 3.
From the figure, the exact size of the GaAs antidot could be obtained. The base
diameter and height are about 20 and 2.5nm, respectively. It
is consistent with the AFM observation.

Fig. 2. TEM
image of five layers GaAs with different thickness, 1.5, 1.75, 2.0, 2.25 and
2.5ML from bottom to top.

Fig. 3. The
magnified TEM image of a GaAs antidot on the surface.
From our study, we can conclude that the transition thickness
of 2-D to 3-D morphology transition for GaAs antodots on InAs is between 2.25
and 2.5ML, which is considerably larger than 1.5ML, the transition thickness for InAs QD formation
on GaAs. However, the obtained transition thickness is also larger than the
previous reported ones, which obtained from RHEED pattern or
in situ STM measurement . To certify there is no re-evaporation of Ga atoms during the growth
due to the absence of arsenic with our MEE method, we have grown another
uncapped sample with 2.25ML GaAs under
the same growth conditions. From the measured AFM image of this sample, as
shown in Fig. 4, there is no 3-D island formed with 2.25ML GaAs. Hence, unambiguously, the 2D–3D
transition thickness of GaAs is larger than 2.25ML.

Fig. 4. AFM
image of 2.25ML GaAs on InAs without migration-enhanced interruption.
3.
Conclusion
In summary, we have grown
GaAs antidots in InAs matrix successfully. The quantum-sized 3-D islands were
observed clearly in both AFM and TEM measurements. From these observations, the
transition thickness is determined to be between 2.25 and 2.25ML. For 2.5ML GaAs
deposition, the grown antidots have a size about 15–35nm in base diameter and about 2–4nm in height with a
density about 3–4×1010cm-2.
Source:Physica E: Low-dimensional Systems and Nanostructures
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