A
mid-infrared type-II 'W' laser fabricated by releasing the epitaxial film from
its original InAs substrate is reported. The process exploits
the extreme selectivity between GaSb and InAs when etched by
hydrochloric acid. The detached film is coated with an Si3N4 optical
cladding layer, grafted to a foreign GaAs substrate, and cleaved into
laser bars. For epitaxial-side-up mounting, the device operates to 70 K, with a
low threshold (≃150 W/cm2) when pumped
with the maximum available CW power of 320 mW from a 980 nm laser diode.
Source:IEEE
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