SUSS
MicroTec, a global supplier of equipment and process solutions for the
semiconductor industry and related markets, has launched the LI Series - a new
Surface Laser Imaging platform as pre- announced on May 4, 2016.
The
highly versatile technology of the LI for laser surface processing ranges from
sub micrometric pattering of resist coated substrates to micro- ablation,
photo-chemistry treatment as well as metrology.
The
patterns, defined by a CAD process, are transferred by accurately moving the
targeted substrates underneath a focused and scanning laser beam. In addition,
the Laser Imager configuration is highly customizable, to best fit the specific
requirements of each user. The technology supports substrate sizes from small
pieces up to 300 mm, and it reaches a resolution down to 0.8 µm. Multi-layer
alignment is possible via both top and bottom side alignment optical systems.
Beside the 405 nm GaN laser for standard thin resist lithography processes, a
second laser source can also be added to additionally address diverse processes
such as, among other, thick resists like SU8, and infrared sensitive materials.
Core
advantage of the Laser Imager is its flexibility, making it suitable for the
various requirements of academic and industrial R&D facilities. The main
applications include a wide variety of nano- and 3D structuring for high resolution
wafer lithography, micro-optical components, sensors, microfluidic devices, and
photo mask manufacturing.
"With
the Surface Laser Imaging platform, we add a tool to our product portfolio that
expands our existing exposure equipment set towards higher resolution
requirements for leading edge applications." says Dr. Per-Ove Hansson, CEO
of SUSS MicroTec AG. "With this addition, we are enhancing our leadership
position and offering the most comprehensive set of products and technologies
for the lithography R&D market."
Source:LEDinside
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